BROWSE BY TECHNOLOGY



RTC SUPPLEMENTS


PRODUCTS & TECHNOLOGY

3U OpenVPX Air-Cooled and Conduction-Cooled Module Development Systems

  • Page 1 of 1
    Bookmark and Share

3U VPX / cPCI Air-Cooled and Conduction-Cooled Module Development Systems

Two OpenVPX-compliant 3U development systems cover both air- and conduction-cooled projects. Just announced by Extreme Engineering, the XPand1200 is a development platform for conduction-cooled modules, and the XPand1300 is designed for air-cooled modules.  Both support a minimum of ten 0.8” or 1.0” pitch slots and are built in accordance with OpenVPX design principles.

The XPand1200 conduction-cooled development system features rapid I/O configuration via rear transition modules (RTMs), star PCIe and Gigabit Ethernet topologies, including PCIe and Gigabit Ethernet switch. The XPand1200 supports up to 550W of total simultaneous power delivery and a thermal dissipation of up to 50W per slot. Weighing 38 lbs (including backplane and power supply) and measuring 8.5” (H) x 11” (W) x 13” (L), the XPand1200 is designed to make the path from conduction-cooled development to deployment effortless. 

The XPand1300 air-cooled development system also features rapid I/O configuration via RTM modules, removable side covers for debug access, star PCIe and Gigabit Ethernet topologies, including PCIe and Gigabit Ethernet switch. Up to 20 CFM of air-flow is provided per slot as well as 550W of total simultaneous power delivery. The XPand1300 provides the system developer maximum performance and flexibility, weighing only 19 lbs, including backplane and power supply, and measuring 13.5” (H) x 13.5” (W) x 11.6” (L). The XPand1200-1 and XPand1300-1 system configurations come standard with the XTend 4130 backplane, the XChange 3012 switch and the XIt3012 RTM.  

The XTend4130 is a 3U VPX development backplane designed in accordance with OpenVPX system architecture specifications that supports one or two centralized switches for a single or dual star topology. When one switch is used, the XTend4130 provides a single star centralized switching topology. When two centralized switches are installed, the XTend4130 supports redundancy on both the control and data planes with a dual star implementation. The XTend4130 provides VITA 46.10 RTM connectors for each payload slot and switch slot, and supports VITA 62 connectors for up to two parallel VITA 62 power supply slots. The XTend4130 also supports power sourced from a development DC-DC power supply.

The XChange3012 is a 3U conduction- or air-cooled VPX module designed in accordance with the OpenVPX system architecture specification that provides both PCI Express and Ethernet switches. The PCIe and Gigabit Ethernet fabrics provide switching for a star topology. The Ethernet fabrics allow VPX cards within the system to communicate and also have access to an outside local area network. The XChange3012 supports an XMC interface via a PCI Express link capable of supporting up to 8 lanes. Dual 10/100/1000Base-T rear I/O from the XMC are also routed directly to the XChange3012's Gigabit Ethernet switch. The XChange3012 can optionally support layer 2 or layer 3 management via an XMC 10/100/1000Base-T interface. XMC RS-232 COM rear I/O can be brought out to the P1 connector.

The XIt3012 RTM provides access to the two 10/100/1000Base-T ports from the XChange3012 integrated PCI Express and Gigabit Ethernet switch. The XChange3012 also provides a Mini DB-9 connector for interfacing with RS-232 I/O from an XMC installed on the XChange3012.

XPand1200 and XPand1300 can be coupled with high-performance, low-power 3U VPX or cPCI X-ES single-board computers (SBC), storage, I/O and companion RTMs. The XPand1200-1 and XPand1300-1 system configurations are available now for $7,500, including backplane, switch and RTM. 

Extreme Engineering Solutions
Middleton, WI.
(608) 833-1155.
[www.xes-inc.com].