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COM Express Module Sports Higher Graphics Performance

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COM Express Module Sports Higher Graphics Performance

A new high-performance COM Express compact module features the Intel GS45 small form factor (SFF) chipset, which enables significant performance increases despite a smaller footprint. The conga-CS45 from Congatec is particularly suitable for mobile applications that require high graphics performance such as portable ultrasound devices. The module also offers true high-end graphics performance ,which, until now, was unprecedented at such small dimensions. Even hardware implemented decompression for HDTV videos is already integrated in the chipset. In addition, the module offers a large choice of graphics interfaces ranging from SDVO, DVI and HDMI to DisplayPort.

The conga-CS45 is equipped with the latest generation of 45nm Intel processors including the Intel Celeron ULV722 with a mere 5.5 watt thermal dissipation power (TDP)—the maximum requirement that is rarely reached in practice—or the Intel Core 2 Duo SP9300 with 25 watt TDP as well as 6 Mbyte secondary cache and a clock speed of  2.3 GHz.

The conga-CS45 can be upgraded to a maximum of 4 Gbytes of DDR3 memory with 1067 MHz. Compared to DDR2 memory, DDR3 technology requires approximately 20% less power. The module has three serial ATA connectors with RAID support, which further improves the performance and data security of mass storage. It also supports Intel Active Management Technology (AMT 4.0), which enables remote control via Ethernet or Internet even before starting the operating system. To meet the special needs of mobile applications, the conga-CS45 permits Core Sleep States C0 to C6, which makes it easy to optimize the power requirements for each scenario. Pricing starts at $576.

congatec
Cardiff-by-the-Sea, CA.
(760) 635-2600.
[www.congatec.us].