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Board Set Merges COM Express Cores with Triple-Play I/O

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Board Set Merges COM Express Cores with Triple-Play I/O

A board-level “embedded-ready subsystem” (ERS) combines the benefits of computer-on-modules (COMs) with those of stackable single-board computers (SBCs). This announcement means system manufacturers no longer need to design a custom carrier to deploy COM Express modules.

Called Magellan from Diamond Systems, the CPU core consists of a COM Express CPU module and heat spreader mounted on its bottom side, resulting in optimal thermal management and increased space for I/O functions and connectors.

This design makes it possible for Magellan to integrate dual gigabit Ethernet LAN ports, a 7-30V DC/DC power supply, a full set of peripheral interface header connectors, stackable PCI-104 or SUMIT expansion, and a FeaturePak I/O module socket, in addition to a complete embedded-PC core—all within the 95 x 125 mm COM Express footprint. Stacking boards in one direction greatly simplifies the thermal design of embedded systems based on high-end CPUs, avoiding costly custom heat pipes and milled aluminum thermal-transfer blocks.

Magellan is offered in a range of models that vary according to the choice of COM Express CPU module and SDRAM capacity (socketed or soldered-on). It can be used either as a highly integrated embedded component, or as a platform for application development and reference designs. The Magellan baseboard includes connectors and interfaces for USB, serial, Gigabit Ethernet, audio and SATA mass storage devices. It also supports the connection of a wide variety of displays, including CRTs, LVDS-interfaced flat panels and televisions.

Small quantities of the Magellan embedded-ready subsystem are available in 30 days in several models, priced as indicated in the table. Development kits that include the Magellan models plus a cable kit and utility software are also available.

Diamond Systems, Mountain View, CA. (800) 367-2104. [www.diamondsystems.com].