PRODUCTS & TECHNOLOGY
COM Express Module with Mobile Core i7 and QM57 Chipset
Page 1 of 1
A new COM Express module is part of a portfolio of Type VI COM Express Basic (small footprint) modules from American Portwell. The Type VI COM Express Basic is becoming a new standard in 2010. At 125 mm x 95 mm (4.92? x 3.74?), the compact PCOM-B216VG-VI is based on the Intel Core i7 processor and the Mobile Intel QM57 Express chipset. This dual-core platform supports error-correcting code (ECC) memory and Intel Active Management Technology (Intel AMT) 6.0 along with Intel Trusted Execution Technology for effective remote management and enhanced security.
In addition, it features two SO-DIMM (non-ECC) sockets to support DDR3 SDRAM 800/1066MT/s up to 8 Gbyte; one Gigabit Ethernet; expansion (via the COM Express carrier board) of one PCI-Express x16 lane, which can be configured to two x8 lanes; one DVI-D, one HDMI and one Display Port (DP) interfaces, seven PCI-E x1, LPC interface and high definition audio interface; and a PCOM-C211 Developer COM Express Type VI carrier board. Equipped with Intel Turbo Boost technology—which automatically allows processor cores to run faster than the basic operating frequency—the PCOM-B216VG-VI addresses the market’s performance and power consumption concerns because it also supports Intel Intelligent Power Sharing Technology. This balances the load of TDP (Thermal Design Power) and temperature between the CPU and the graphics engine by enforcing power clamps to non-turbo levels.