PRODUCTS & TECHNOLOGY
Fanless Dual-Core Computing and USB 3.0 Come to Thin Embedded Devices
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A new Em-ITX form factor board combines rich I/O with advanced multimedia capabilities. Partnered with a new industrial chassis kit, the VIA EITX-3002 from Via Technologies provides a solution for a wide range of durable and fanless next generation devices in medical, healthcare, industrial and building automation, digital signage, kiosk, POI/POS, gaming and surveillance applications.
The VIA EITX-3002 is based on the 17 cm x 12 cm Em-ITX form factor, and is powered by a choice of a 1.2 GHz VIA Nano X2 E-Series or 1.0 GHz VIA Eden X2 dual core processor. The VIA EITX-3002 takes advantage of the VIA VX900H media system processor, a feature packed all-in-one digital media chipset that brings excellent hardware acceleration for the latest HD video formats including MPEG-2, H.264, VC-1, WMV9 and HDCP for Blu-ray content protection in stunning 1080p display. The VIA EITX-3002 supports dual independent display, allowing different content to be shown in different resolutions for superior digital signage displays.
The unique design of the Em-ITX form factor places the VIA processor and VIA VX900H MSP on the reverse side of the board, optimizing the available real estate for a rich I/O configuration and facilitating slim fanless chassis designs. The VIA EITX-3002 includes an onboard DC-to-DC converter supporting both AT and ATX power modes, and power input voltages of DC 7V to DC 36V. An onboard built-in 5-wire/4-wire USB Touch interface makes the EITX-3002 highly suited for high-end interactive touch screen multimedia applications.
VIA Technologies, Fremont, CA. (510) 683-3300. [www.via.com.tw/en].