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COM Express Type 6 Module Extreme Rugged Solution for Mobile Environments

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A COM Express Type 6 module based on the quad/dual-core  second generation Intel Core i7 processor and Mobile Intel QM67 Express Chipset is targeted at mobile applications running in harsh environments. The Express-HRR from Adlink Technology follows Adlink’s “Rugged by Design” methodology for use in environments prone to severe shock, vibration, humidity and extended temperature ranges.

The Ampro by Adlink Express-HRR is a modular, power-efficient solution for mobile applications running in space constrained, extreme rugged environments. The Express-HRR is compatible with the COM Express COM.0 Revision 2.0 Type 6 pinout, which is based on the popular Type 2 pinout, but with legacy functions replaced by digital display interfaces (DDI), additional PCI Express lanes, and reserved pins for future technologies. The new Type 6 pinout also supports the SPI Interface, which was unavailable in COM.0 Rev. 1.0.

The Ampro by Adlink Express-HRR offers up to 16 GB ECC 1333 MHz DDR3 memory in two SODIMM sockets; three DDIs for DisplayPort/HDMI/DVI/SDVO; eight PCIe x1 and one PCIe x16 (Gen2) for graphics (or general purpose x8/4/1); as well as two SATA 6 Gb/s, two SATA 3 Gb/s, Gigabit Ethernet, and eight USB 2.0 interfaces. The Express-HRR is validated for reliable performance in extended temperatures ranging from -40°C to 85°C and features a 50 percent thicker printed circuit board (PCB) for high vibration tolerance.

 

ADLINK Technology
San Jose, CA
(408) 360-0200
www.adlinktech.com