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Power Efficient Dual Core Processing in a Ruggedized Chassis System

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An ultra-compact, fanless system is designed around the tiny VIA EPIA-P900 Pico-ITX board. The VIA AMOS-3002 from Via Technologies leverages the digital performance of the combined 1.0 GHz VIA Eden X2 dual core processor and the VIA VX900H media system processor (MSP) on the VIA EPIA-P900 board. The VIA AMOS-3002 offers a powerful, rugged and HD-ready industrial-class PC that combines 64-bit computing in an ultra-compact system. The highly integrated, all-in-one VIA VX900H boasts hardware acceleration of the most demanding codecs, including MPEG-2, WMV9 and H.264, in resolutions up to 1080p across the latest display connectivity standards, including native HDMI support, for next generation multimedia-intensive applications.

The system operates completely fanlessly within a robust chassis measuring 19.7 cm x 10.4 cm x 4.9 cm (WxDxH). The VIA AMOS-3002 has a certified operating temperature of -20 to 60 degrees C, vibration tolerance of up to 5 Grms and a shock tolerance of up to 50G. The VIA AMOS-3002 is also available with the VIA EPIA-P830 featuring a 1.0GHz Nano E-Series processor, offering an operating temperature of -20 to 70 degrees C.

Storage is provided through a Cfast slot for a SATA interface Flash drive while an optional storage subsystem expansion chassis offers support for a standard 2.5” SATA drive. Comprehensive I/O functions on front and rear panels include two COM ports, six USB 2.0 ports, including two of which are lockable for increased ruggedization, line-in/out, one DIO port, one VGA and one HDMI port for display connectivity and two GLAN ports for dual Gigabit networking. Optional Wi-Fi and 3G networking are available through a MiniPCIe expansion slot.

VIA Technologies
Fremont, CA.
(510) 683 3300
www.via.com.tw