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Third Generation Intel Core i7 combines with Serial RapidIO on AMC boards

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Concurrent Technologies released and demonstrated the latest additions to their MicroTCA product family—the latest AMC processor boards featuring either dual or quad core third generation Intel Core i7 processors based on 22nm process technology combined with IDT’s Tsi721 PCIe to RapidIO bridge to provide a highly efficient interface to a Serial RapidIO (SRIO) backplane. Additionally, support for SRIO has been added to the previously released Fabric Interconnect Networking Software (FIN-S), which provides standardized uniform APIs across a fabric interconnect. The result is a high-bandwidth and low-latency solution that utilizes about 5% of the CPU’s bandwidth and provides a realistic opportunity for users of PowerPC/SRIO products to transfer to Intel processor technology. Applications for this hardware and software solution are expected within both the telecom and defense markets, especially where a large number of computing nodes are required to intercommunicate at high data rates.

Depending upon I/O requirements, system designers have a choice of two high-performance processor boards—the AM 93x/x1x or the AM 94x/x1x. Users can take advantage of the boards’ processing power, high-performance backplane fabric connectivity and the peer-to-peer networking performance of SRIO to develop large multiprocessing systems. These processor boards are particularly well suited for MicroTCA-based telecommunication applications such as IPTV, digital media servers, media gateways, broadband, Long Term Evolution (LTE) or LTE-Advanced, wireless base stations as well as in test systems for wireline and wireless networks. 

All variants of AM 93x/x1x and AM 94x/x1x support Fabric Interconnect Networking Software (FIN-S), which provides high-performance Ethernet emulation over SRIO along with other application level interfaces. FIN-S enables plug and play of any TCP/IP-based application across the SRIO fabric, thereby reducing the development effort and time-to-market for the user by providing a very high degree of application portability and reusability. The main features and benefits of using FIN-S on SRIO include more than 60% practical application level bandwidth when compared to 10 GigE as well as more than double the performance with half the CPU utilization compared to open source SRIO Ethernet emulation solutions. TCP/IP Application level bandwidth of more than 1.8 Gbyte/s is achieved with Gen 2 SRIO 5 Gbaud/s x4 links. This solution also boasts “jitterless” TCP/IP packet latencies of less than 10 microseconds.

Concurrent Technologies, Woburn, MA. (781) 933-5900. [www.gocct.com].