PRODUCTS & TECHNOLOGY
FPGA Family Offers Advanced, Low-Cost per I/O Connectivity Interfaces
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An ultra-low-density FPGA family is aimed at expanding system capabilities and bridging emerging connectivity interfaces using both parallel and serial I/O. By matching advanced, small-footprint packaging with on-chip resources, the MachXO3 family from Lattice Semiconductor puts affordable innovation into the hands of system architects by simplifying the implementation of emerging connectivity interfaces such as MIPI, PCIe, GbE and much more.
The ultra-low-density MachXO3 FPGA family gives customers a single programmable bridge that lets them build differentiated systems using the latest components and interface standards. With advanced package technology solutions that eliminate bond wires to enable lowest-cost and increased I/O density in a small footprint, the MachXO3 family can be used across market segments, including consumer, communications, compute, storage, industrial and automotive.
Lattice’s MachXO and MachXO2 families of instant-on, non-volatile programmable devices provide system architects complete, low-cost options to expand general purpose I/O, bridge interfaces and minimize total system power. Leveraging a low-power architecture built on 40nm process technology to deliver lower cost with increased performance for power sensitive applications, the new MachXO3 family delivers a new set of capabilities that enable system engineers to do even more in a smaller footprint.
The new 640-to-22K logic-cell family makes use of the latest in package technology to not only deliver tiny 2.5 x 2.5 mm wafer-level chip-scale packaging, but also 540 I/O count devices, as well as devices with 3.125 Gbit/s SERDES capabilities to cover the full spectrum of bridging and interface requirements in consumer, industrial, communications, automotive and compute markets. The devices are supported by Lattice Diamond software, as well as IP and application expertise both in-house and by third parties. Pricing starts below $1.00 in high volume.