Editor's Report

The Application Services Platform: A New Class of Device for Embedded Development and Systems

There have been many attempts over the years to achieve a highly integrated system-level device on a single piece of silicon. There have been ASICs, ASSPs, SoCs and more. There have beeRead More...

Industry Insider

Industry Insider

FeaturePak Initiative to Move Spec to Standards Organization In the wake of the introduction of the FeaturePak I/O module specification, efforts are underway to establish it as a recogRead More...

Technology Connected

PCIe? USB? Sorting Out Two COM / SFF Design Decisions

Among all the bus types available in most COM specifications, only USB and PCI Express (PCIe) are well supported, high-level buses, with plug-and-play and excellent interoperability. A Read More...

Technology Deployed

High-Speed Digitizers Recapture Innovation as ADCs Yield to FPGAs

Prior to the new millennium, skilled hardware engineers pushed the technology envelope with inventive wideband digitizer designs leveraging an assortment of discrete logic integrated ciRead More...