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- This is really amazing and saves labor,time and money at field. Definitely, this will be welcomed by instrumentation community
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QUICK DOWNLOADS
Thermal Management
Techniques and technologies for removing heat from systems through methods like convection, conduction and others.
AMCC Becomes AppliedMicro—with the Focus on Low-Power Processing
Electricity—we’re using more of it and it’s costing more. And so much of it that we use is wasted, simply dissipated as heat, which requires even more electricity in the form ofRead More...
Air and Conduction Cooling for 3U COTS Cards: An Overview
There are many trends at the die level and circuit card level that can drive the decision of which cooling method to use for 3U COTS cards in rugged applications. One of these trendsRead More...
Quad-Core Blade Server in New CoolShell Package
Quad-Core Blade Server in New CoolShell Package The principle barrier to higher compute density in modular electronic packaging is the cooling and mechanical stabilization ofRead More...
Low Profile Heat Sinks Cool Hot Components in Constricted Packages
A line of lower height heat sinks is designed for cooling ICs and other hot components in narrow packaging and low airflow velocity conditions. The maxiFLOW heat sinks from AdvancedRead More...