RTC Magazine

Thermal Management of High Power in Small Spaces: Myths and Misconceptions Challenged

Conduction-Cooled ATR 6U VPX Platform Provides High Thermal Performance

AMCC Becomes AppliedMicro—with the Focus on Low-Power Processing

Electricity—we’re using more of it and it’s costing more. And so much of it that we use is wasted, simply dissipated as heat, which requires even more electricity in the form ofRead More...

Air and Conduction Cooling for 3U COTS Cards: An Overview

There are many trends at the die level and circuit card level that can drive the decision of which cooling method to use for 3U COTS cards in rugged applications. One of these trendsRead More...

Quad-Core Blade Server in New CoolShell Package

Quad-Core Blade Server in New CoolShell Package   The principle barrier to higher compute density in modular electronic packaging is the cooling and mechanical stabilization ofRead More...

Low Profile Heat Sinks Cool Hot Components in Constricted Packages

A line of lower height heat sinks is designed for cooling ICs and other hot components in narrow packaging and low airflow velocity conditions. The maxiFLOW heat sinks from AdvancedRead More...

Thermal Analysis and Heat Sink Design Optimize Cooling of High-Performance Modules

A leading provider of embedded computing solutions needed to determine the thermal characteristics of its new packet processor. Such devices often entail complex heat transfer andRead More...

If You Cant Take the Heat... Get out of the Stack

In spite of the new ultra-low-power silicon on the market, it’s tempting to bite off more than you can cool. If you ‘duo’ (do), you can blow your diet threefold—first, you can killRead More...

EPIC-Express Board Demonstrates New Cooling Concept and Mechanical Design

EPIC-Express Board Demonstrates New Cooling Concept and Mechanical Design A new product family targets strategic mission-critical systems and enables easy andRead More...

MMC Management Solution Using ACTEL SmartFusion

A new module management controller (MMC) board management reference (BMR) starter kit is based on Actel’s SmartFusion intelligent mixed signal programmable/configurable applicationRead More...

Thermal Management and Power Integrity in Tight Spaces

The advent of programmable logic devices (PLDs) increased circuit component miniaturization and increasing circuit densities on PCBs have introduced an exponential increase in powerRead More...

CPU Cooler Improves Airflow, Water Block and Heat Dissipation Capacity

A CPU cooler is designed to provide an extremely efficient cooling solution for CPUs from Intel and AMD. The Hydro Series H70CPU cooler from Corsair is an evolution of the Hydro SeriesRead More...

3U VPX Air Baffle Board

A new VPX air blocker board in the 3U height is designed to fill in unused slots and redirect (or contain) airflow. VPX systems can require high levels of heat dissipation. The airRead More...

Compression-Based A-to-D Converters: Reaching New Low Power Limits in Quantization

In traditional analog-to-digital conversion, the signal is “blindly” converted without any consideration to the signal type or statistics. As a result, the conversion process wastes aRead More...

Mandates for Power Efficiency Push Telcom Providers Toward Software Optimization

Power efficiency has emerged as one of the key areas for long-term improvement in telecom applications. Reduced energy usage means lower costs and diminished environmental impact. InRead More...

A New Approach to 3U VPX Pre-Configured Conduction Cooled Systems

Size, weight and power (SWaP) requirements have dramatically changed the embedded military and aerospace system landscape. As VPX systems mature, the size and modularity of the 3U formRead More...

Updates to xTCA Management Controller Solutions for Smartfusion

Pigeon Point Systems has announced the release of significant enhancements to its xTCA management controllers solutions based on the Microsemi SmartFusion intelligent mixed signalRead More...

Energy Harvesting Applications are Everywhere

The concept of energy harvesting has been around for over a decade; however, the implementation of ambient energy-powered systems in the real-world environment has been cumbersome,Read More...

Small, Flexible Candlestick Sensor Measures Temperature and Air Velocity

A flexible, robust candlestick sensor can simultaneously measure both temperature and air velocity for characterizing thermal conditions in electronic systems. The MS 1000-CS-WC fromRead More...

Conduction Keeps Computing Cool

Reliable. Quiet. Affordable. Small. With protection from dust and humidity, and flexible mounting options. And easy on the electric bill. System designers expect everything fromRead More...

Rugged, Liquid Cooled ATR Chassis Accepts 6U VPX Boards

A new rugged 1 ATR tall, short enclosure with independent dual liquid cooled side walls offers significantly better cooling than conduction only and air-flow designs. Targeted forRead More...

ARM-Based Module Solutions to Deliver Low-Power Building Blocks for Smart Connected Applications

ARM-based platforms dominate low-power market segments, especially for smartphones, tablets and HMI subsystems. Welcoming news for embedded designers is that the ARM processorRead More...

Smart Cooling Pipes Pave the Way for Performance Growth in COM Express

A new cooling system for the COM Express specification is based on cooling pipes, which are integrated in the standardized heat spreader. Introduced by congatec, this solution makes itRead More...