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RTC Magazine Digital Edition

INDUSTRY NEWS

RECENT COMMENTS

  • Hi Juan, This article shows you how to implement a quadrature encoder interface on the FPGA using digital lines. It was written for our PCI or P...

    Meghan Meckstroth Kerry - See Article

  • Good coverage on the general advantages of COM, and X86 implementations. It would have been nice to ARM options for lower-power (handheld) applicat...

    Brian Empey, P.Eng. - See Article

  • Your article about Application Service Platforms in RTC April is another example of great reporting by RTC. Can we have a new RTC index category -...

    Kenneth G Blemel - See Article

  • Static analysis tools/scanners are a great arsenal for companies who require high quality code. It does a great job of finding a wide range of pro...

    Andrew Yang - See Article

  • I hope that the microcessor based Insulin Pump riding on my belt would be held to a higher standard. If it quits, I can work around that inconvenie...

    Karl Williamson - See Article

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RTEC10 is an index made up of 10 public companies which have revenue that is derived primarily from sales in the embedded sector. The companies are made up of both software and hardware companies being traded on public exchanges.

COMPANY PRICECHANGE
Kontron
7.81
4.577%
Adlink
1.54
2.388%
Advantech
2.32
1.505%
Interphase
1.61
-3.012%
Radisys
9.26
-1.016%
-   Performance Technologies2.100.000%
-   Enea5.630.000%
PLX
3.62
-3.209%
Mercury Computer
11.76
-2.931%
Elma
412.98
-0.476%
HIGH LOW MKT CAP
7.85
7.43
435.04
1.58
1.52
185.11
2.33
2.30
1,198.70
1.70
1.61
11.00
9.41
9.24
223.74
2.102.1023.34
5.635.54101.86
3.74
3.61
134.28
12.17
11.76
279.57
412.98
412.98
94.25
RTEC10 Index: 490.94 (1.11%)
RTEC10 is sponsored by VDC research

Thermal Management

Techniques and technologies for removing heat from systems through methods like convection, conduction and others.

Featured Article

Thermal Management for the Small Box

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Thermal Management of High Power in Small Spaces: Myths and Misconceptions Challenged

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Conduction-Cooled ATR 6U VPX Platform Provides High Thermal Performance

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AMCC Becomes AppliedMicro—with the Focus on Low-Power Processing

Electricity—we’re using more of it and it’s costing more. And so much of it that we use is wasted, simply dissipated as heat, which requires even more electricity in the form ofRead More...

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Air and Conduction Cooling for 3U COTS Cards: An Overview

There are many trends at the die level and circuit card level that can drive the decision of which cooling method to use for 3U COTS cards in rugged applications. One of these trendsRead More...

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Quad-Core Blade Server in New CoolShell Package

Quad-Core Blade Server in New CoolShell Package   The principle barrier to higher compute density in modular electronic packaging is the cooling and mechanical stabilization ofRead More...

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Low Profile Heat Sinks Cool Hot Components in Constricted Packages

A line of lower height heat sinks is designed for cooling ICs and other hot components in narrow packaging and low airflow velocity conditions. The maxiFLOW heat sinks from AdvancedRead More...

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Thermal Analysis and Heat Sink Design Optimize Cooling of High-Performance Modules

A leading provider of embedded computing solutions needed to determine the thermal characteristics of its new packet processor. Such devices often entail complex heat transfer andRead More...

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If You Cant Take the Heat... Get out of the Stack

In spite of the new ultra-low-power silicon on the market, it’s tempting to bite off more than you can cool. If you ‘duo’ (do), you can blow your diet threefold—first, you can killRead More...

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EPIC-Express Board Demonstrates New Cooling Concept and Mechanical Design

EPIC-Express Board Demonstrates New Cooling Concept and Mechanical Design A new product family targets strategic mission-critical systems and enables easy andRead More...

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MMC Management Solution Using ACTEL SmartFusion

A new module management controller (MMC) board management reference (BMR) starter kit is based on Actel’s SmartFusion intelligent mixed signal programmable/configurable applicationRead More...

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Thermal Management and Power Integrity in Tight Spaces

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CPU Cooler Improves Airflow, Water Block and Heat Dissipation Capacity